12 x 25.78125 Gbps

FTGA-12TR8525G-02I 压接式 LGA 封装 12 路并行光收发一体模块 V3.06 (12×25.78125Gbps 多模 850nm VCSEL 70m@OM3 100m@OM4 MT/APC 斜8°研磨 38×24×5.5mm -55~+85°C 超宽温 CDR 切换 I2C 0xA0 数字监控 12通道光功率) | F-tone Networks 北亿纤通

10G光模块, FTGA-12TR851X-02I系列, FTGA-12TR8525G-02I系列 压接式LGA封装12路并行光收发一体模块 (12×25.78125G 多模 850nm MT/APC 斜8° -55~+85°C 38×24×5.5mm)-3dBm, -55 to +85, -55 to 100, -55°C, -55°C to +85°C, -55~+100, -55~+85, -55C, -55C to +85C, -9dBm, +85°C, +85C, 0x22-0x39, 0xA0, 0xA1, 10.3125 Gbps, 10.3125G, 100 ohm Differential, 12 ch 25G, 12 Channel Parallel, 12 channels 25G, 12 x 25.78125 Gbps, 12 x 25G, 12 路并行, 12 路并行光收发, 12 路并行模块, 12 通道 25G, 12 通道 VCSEL, 12-Ch 25G, 12-Channel 25.78G, 12-Channel Data, 12-Channel Parallel, 12-Channel Parallel 25G, 12-Channel VCSEL, 12-Channel x 25.78G, 12ch 25.78G, 12x25G, 200 Pin Connector, 200 Pin Header, 200 Pin Socket, 200 引脚, 200-Pin Header, 200-Pin LGA, 200-Pin Socket, 24 Core MT, 24 Fiber MT, 24 Fiber MT Ferrule, 24 芯 MT 插芯, 24-Core MT, 25.78 Gbps, 25.78 Gbps NRZ, 25.78125, 25.78125 Gbps, 25.78G, 25G NRZ, 25Gbps, 2800 mA, 2800mA, 2800mA Current, 3 dB ER, 3.3 V, 3.30V, 3.3V Power, 3.3V Single Supply, 3.3V 单电源, 309.375 Gbps, 3dBm, 5E-5, 70 100m, 70 to 100m, 70-100m, 70/100m, 8 Degree Angle, 8 度斜面, 8.5-10.3125Gbps, 8.5G, 8.5G to 10.3125G, 8.5G-10.3125G, 8.5Gbps, 8° Angle, 850 nm, 850 nm Center, 850 nm CW, 850 nm VCSEL, 850-nm, 850nm CW, 9 Watt, 9W, AC CML, AC-Coupled CML, AI Compute, AI Computing, AI GPU, AI GPU Interconnect, AI Interconnect, AI Server, AI 算力, AI 算力互联, Alarm Indicator, Alarm Signal, ALERTN Pin, Angled PC, Angled Physical Contact, APC MT, APC Polish, APC 研磨, ASIC Connection, ASIC Interconnect, ASIC Optical, ASIC 互连, BER <= 5e-5, BER 5E-5, BER<5E-5, BER<5x10-5, Bit Error Rate, Cabinet Internal, Cable Length 100m, Cable Length 70m, Case Temperature -55, Case Temperature 85, CDR Enable, CDR Enable Pin, CDR Function, CDR Switching, CDR 切换, CDR_EN, CDR_EN Pin, Ch1 Power, Ch1-Ch12 Power, Ch12 Power, Channel 1 Power, Channel 12 Power, Channel Power Monitor, Channel Power Monitor Register, CML Level, CML 电平, Current 2800mA, DDMI 监控, Differential 100 ohm, Differential 100Ω, Differential CML, Differential ESD, Differential Impedance, Differential Pair, Differential Signal, Digital Monitoring, Dual Rate, Dual Rate Support, Embedded Module, Embedded Transceiver, ER 3dB, ESD 1000V, ESD 500V, ESD Hardened, ESD 防护, Extended Temperature, Extreme Temperature, Eye Mask, FEC Margin, FPGA Communication, FPGA Connection, FPGA Interconnect, FPGA Optical, FPGA Transceiver, FPGA 互连, FTGA, FTGA 12 Channel, FTGA 12 Parallel, FTGA 12 路, FTGA 12 路并行, FTGA 12-Channel, FTGA 12-Channel Parallel, FTGA Datasheet, FTGA Embedded Module, FTGA Parallel Optical, FTGA Parallel Transceiver, FTGA Series, FTGA Series Datasheet, FTGA Series V3.06, FTGA Spec Sheet, FTGA Tech Spec, FTGA V3.06, FTGA 并行光收发, FTGA 并行光模块, FTGA-12, FTGA-12TR8525G, FTGA-12TR8525G-02I, FTGA-12TR8525G-02I V3.06, Hardened Grade, High Temp Case, HPC AI, HPC Cluster, HPC Connection, HPC Data Center, HPC GPU, HPC Supercomputer, I2C 0xA0, I2C 0xA1, I2C Address 0xA0, I2C Address 0xA1, I2C 接口, I2C 通信, Icc 2800mA, Impedance 100 ohm, Impedance 100Ω, Industrial Wide Temp, Inter-cabinet, Inter-cabinet Interconnect, Inter-rack, Inter-rack Connection, Intra-cabinet, Intra-cabinet Connection, Intra-cabinet Interconnect, Intra-rack, LGA 200, LGA 200 Pin, LGA 200 Pin Connector, LGA 200 引脚, LGA 200-Pin, LGA 200pin, LGA Assembly, LGA Board-mounted, LGA Embedded, LGA Embedded Module, LGA Land Grid Array, LGA On-board, LGA Package, LGA Press-fit, LGA Press-fit Module, LGA SMT Solderless, LGA Solder Pads, LGA Solderless, LGA 压接式, LGA 封装, LGA 嵌入式, LGA 嵌入式模块, LGA 弹片, LGA 板载, LGA 板载光模块, LGA 焊盘, LGA 装联, LGA 装配, Logic Level, MARGIN, Margin 20%, Mask Margin, Mask Test Pass, Memory Map, MemoryMap, MemoryMap 0x04, MemoryMap 0x05, MemoryMap 0x22, MemoryMap 0x23, Military Temp, MM Parallel, MMF Parallel, MT 24, MT 24 Core, MT 24 Fiber, MT 24-Core, MT 24-Fiber, MT 24芯, MT 8 degree, MT 8 度, MT 8-degree, MT 8°, MT APC, MT Connector, MT Plug, MT Socket, MT 套圈, MT 插芯, Multi-channel Data, Multi-channel Parallel, Multi-mode Parallel, Multi-rate CDR, Multi-rate Support, Multimode 850nm, Multimode Parallel, Multimode VCSEL, NRZ Signal, NRZ 信号, NRZ 调制, PAM4 Modulation, Parallel 12, Parallel Channel, Parallel Data Communication, Parallel Optical, Parallel Optical Module, Pin Press-fit, Post FEC, Post-FEC, Power 3.3V, Power 9 Watt, Power 9W, Power Budget 9dB, Power Supply 3.3V, PRBS Pattern, PRBS31, PRBS31 Pattern, Pre FEC, Pre-FEC, Press-fit Assembly, Press-fit Contact, Press-fit LGA, Press-fit Module, Press-fit Optical, Press-fit Press-in, Press-fit SMT, Press-fit Tooling, Press-fit Transceiver, Pseudo Random, Pseudorandom, Rack to Rack, Rack-to-rack, Rate Switch, Register Address, Register Map, Reset, RX Enable, Rx Los Pin, RX Saturation, Saturation Power, SD Pin, Sensitivity -9 dBm, Serial Clock, Serial Data, Short Range, Short Range Interconnect, Short Range Parallel, Signal Detect Pin, Signal Loss, Single Channel 25G, Single Power Supply, Single Supply, Solderless Assembly, Solderless Install, Solderless Module, Solderless Mount, Solderless Press, Storage Temp, Storage Temperature, Supercomputer Interconnect, Supercomputing, Supply Voltage, Temp Monitor, Transceiver Module, Tstg -55 to 100, Tx Disable Function, TX Enable, TX Power -3 to 3 dBm, TXEN RXEN, Vcc 3.3V, VCSEL 12 通道, VCSEL 12-Channel, VCSEL 阵列, Voltage Monitor, Voltage Monitoring, Wavelength 850nm, Wide Temperature, Zin 100Ω, Zout 100Ω, 中心波长 850nm, 串行数据, 串行时钟, 交流 CML, 光收发一体, 军标温度, 冲击, 功率预算, 压接式, 压接式 SMT, 压接式 Transceiver, 压接式光收发一体模块, 压接式光模块, 压接式无焊接, 双速率, 发射使能, 发射光功率, 发射功率, 发射功率 -3~3dBm, 告警指示, 复位, 多通道并行, 失光告警, 寄存器映射, 工业级宽温, 差分 CML, 差分对, 差分阻抗, 并行数据通信, 弹片压接, 弹片压接式, 弹片接触, 振动, 接收使能, 接收功率, 数字监控, 斜 8 度, 斜8度, 斜8度角, 斜8度角 APC, 斜面物理接触, 无焊接安装, 无焊接模块, 时钟数据恢复, 机柜间, 极端温度, 湿度, 灵敏度 -9dBm, 眼图, 短程, 短程互连, 误码率, 超宽温, 超算, 超级计算机, 超级计算机机柜间, 通道光功率监控, 速率切换, 逻辑电平