FTAF-Bxx24-10DSxx 2.5Gbps BIDI SC 2×5 SFF光收发器规格书 — 2.5G BIDI SC SFF Transceiver

FTAF-Bxx24-10DSxx 2.5Gbps BIDI SC 2×5 SFF光收发器

2.5Gbps 1310/1550nm (1550/1310nm) 10km BIDI SC P2P 2×5 SFF Transceiver


2.5Gbps 1310/1550nm(1550/1310nm) 10km BIDI SC P2P

2×5 SFF Transceiver

FTAF-Bxx24-10DSxx

Features

 Data rate up to 2.5Gbps

 SFF 2×5 package with Bi-Directional SC receptacle optical interface

 Single 3.3V power supply

 Digital Diagnostic Monitoring function implemented

 Internal calibration

 Low EMI and excellent ESD protection

 Class I laser safety standard IEC-60825 compliant

 Operating temperature range: 0oC ~+70oC or -40oC ~+85oC

 RoHS6 Compliance

Applications

 Fast Ethernet

 Gigabit Ethernet

 SONET OC-48

 SDH STM-16

 Other Optical Links

Standards

 Complies with SFP Multi-Source Agreement (MSA) SFF-8074i

 Complies with ITU-T G.957

 Complies with SFF-8472

 Complies with FCC 47 CFR Part 15, Class B

 Complies with FDA 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No.

50, dated June 24, 2007

Specification

A bsolute Maximum R atings

Parameter Symbol Min Max Unit

Storage Ambient Temperature T STG -40 85 °C

Storage Humid ity H S 5 90 %

Operating Hum idity H O 5 85 %

Power Supply Voltage V CC 0 3.6 V

Receiver Damaged Threshold +4 dBm

Soldering Temperature 260/10 °C/S

Recommended Operating Conditions

Parameter Min Max Unit Notes

Symbol Typical

FTAF-Bxx24-10 DS

-5 70

Operating Case Temperature Tc °C

-40 85 FTAF-Bxx24-10DSI

Power Supply Voltage V CC 3.135 3.3 3.465 V

Power Consumption P W 1 W

Data Rate 2.5 Gbps

Electrica l Charac teristics

Para meter S ymbol M in Ty pical Ma x Unit Notes

Total Supply Current I

CC

300 mA

Transmitter

Transmitter Differential Input Voltage 300 2400 mV

Transmitter Common-Mode Da ta Input

V 1.6 2.4 V

CM

Voltage

Tx_Fault Output Voltage-High V OH 2.4 V CC V LVTT L

Tx_Fault Output Voltage- Low V OL 0 0.4 V LVTTL

A bsolute Maximum R atings        
Parameter Symbol Min Max Unit
Storage Ambient Temperature T
STG
-40 85 °C
Storage Humid ity H
S
5 90 %
Operating Hum idity H
O
5 85 %
Power Supply Voltage V
CC
0 3.6 V
Receiver Damaged Threshold   +4   dBm
Soldering Temperature     260/10 °C/S
Recommended Operating Conditions            
Parameter Symbol Min Typical Max Unit Notes
Operating Case Temperature Tc -5   70 °C FTAF-Bxx24-10 DS
    -40   85   FTAF-Bxx24-10DSI
Power Supply Voltage V
CC
3.135 3.3 3.465 V  
Power Consumption P
W
    1 W  
Data Rate     2.5   Gbps  
Electrica l Charac teristics            
Para meter S ymbol M in Ty pical Ma x Unit Notes
Total Supply Current I
CC
    300 mA  
Transmitter            
Transmitter Differential Input Voltage   300   2400 mV  
Transmitter Common-Mode Da ta Input
Voltage
V
CM
1.6   2.4 V  
Tx_Fault Output Voltage-High V
OH
2.4   V
CC
V LVTTL
Tx_Fault Output Voltage- Low V
OL
0   0.4 V LVTTL

Electrical Characteristics

Parameter Symbol Min Typical Max Unit Notes

Tx_SD Output Voltage – High V OH 2.4 V CC V LVTTL

Tx_SD O utput Voltage – Low V 0 0.4 V LVTTL

OL

TX_Dis Input Voltage – High V 2 V V LVTTL

IH CC

TX_Dis Input Voltage- Low V 0 0.8 V LVT TL

IL

Input Differential Impedance 85 100 115 Ω

Rec eiver

Receiver Differential Output Voltage 500 1200 mV AC Coupled

SD Voltage – High V SDH 2.4 V CC V LVTTL

SD Voltage -Low V 0 0.4 V LVTTL

SDL

SDAssert Time T 100 us

LOSA

SDDe-assert Time T 100 us

LOSD

Output Differential Impedance 90 100 110 Ω

Optical Transmitter Characteristics

Parameter Symbol Min Typical Max Unit Notes

Average Output Power P OUT -9 -3 dBm

Extinction Ratio ER 8.2 dB

1260 1310 1360

Center Wavelength λ nm

C

1500 1550 1600

3.5

Spectrum Width ∆λ nm

1

Side Mode suppression Ratio SMSR 30 dB

Optical Rise Time T 260 ps 20% to 80%

R

Optical Fall Time T 260 ps 20% to 80%

F

Transmitter OFF Power P OFF -45 dBm

Output Eye Diagram Complies with ITU-T G.957

Relative Intensity Noise -115 dB/Hz

Optical Return Loss Tolerance 15 dB

Transmitter Reflectance -10 dB

Transmitter and Dispersion Transmit on 10km

TDP 2 dB

Penalty SMF

Jitter P-P T

J

0.1 UI

Optical Receiver Characteristics

Parameter Symbol Min Typical Max Unit Notes

1500 1550 1600

Center Wavelen gth λ nm

C

1260 1310 1360

Receiver Sensitivity SEN -18 dBm Note 1

Electrical Characteristics            
Parameter Symbol Min Typical Max Unit Notes
Tx_SD Output Voltage – High V
OH
2.4   V
CC
V LVTTL
Tx_SD O utput Voltage – Low V
OL
0   0.4 V LVTTL
TX_Dis Input Voltage – High V
IH
2   V
CC
V LVTTL
TX_Dis Input Voltage- Low V
IL
0   0.8 V LVT TL
Input Differential Impedance   85 100 115 Ω  
Rec eiver            
Receiver Differential Output Voltage   500   1200 mV AC Coupled
SD Voltage -High V
SDH
2.4   V
CC
V LVTTL
SD Voltage -Low V
SDL
0   0.4 V LVTTL
SDAssert Time T
LOSA
    100 us  
SDDe-assert Time T
LOSD
    100 us  
Output Differential Impedance   90 100 110 Ω  
Optical Transmitter Characteristics            
Parameter Symbol Min Typical Max Unit Notes
Average Output Power P
OUT
-9   -3 dBm  
Extinction Ratio ER 8.2     dB  
Center Wavelength λ
C
1260 1310 1360
1600
nm  
    1500 1550      
Spectrum Width ∆λ     3.5
1
nm  
Side Mode suppression Ratio SMSR 30     dB  
Optical Rise Time T
R
    260 ps 20% to 80%
Optical Fall Time T
F
    260 ps 20% to 80%
Transmitter OFF Power P
OFF
    -45 dBm  
Output Eye Diagram Complies with ITU-T G.957          
Relative Intensity Noise       -115 dB/Hz  
Optical Return Loss Tolerance       15 dB  
Transmitter Reflectance       -10 dB  
Transmitter and Dispersion
Penalty
TDP     2 dB Transmit on 10km
SMF
Jitter P-P T
J
    0.1 UI  
Optical Receiver Characteristics            
Parameter Symbol Min Typical Max Unit Notes
Center Wavelen gth λ
C
1500 1550 1600
1360
nm  
    1260 1310      
Receiver Sensitivity SEN     -18 dBm Note 1

Input Saturation Power (O verload) SAT -3 dBm

SD Assert Level SDA -19 dBm

SD De-assert Lev el SDD -35 dBm

SD Hysteresis HYS 0.5 6 dB

Note 1: Measured with PRBS 231-1@2.5Gbps, ER=8.2dB, BER ≤1×10-12

Digital Diagnostic Monitoring Information

Parameter Accura cy Calibratio n No te

Temperatu re ±3°C Internal

Voltage ±3% Internal

Bias Curren t ±10mA Internal

TX Power ±3dB Internal

RX Power ±3dB Internal

Note: The digital diagnostic monito ringinterface defines 256-byte memory mapin EEPROM, which makes

use of the 8 bit address 1010001X(A2h). Please refer to the SFF-8472 Rev 10.2for the detailinformation.

Pin Definition

FTAF-Bxx24-10DSxx 引脚定义图
FTAF-Bxx24-10DSxx 引脚定义图

PinNo Name Function Notes

1 V

EE

R Receiver Ground

2 V

CC

R Receiver Power

3 RX_SD Receiver Signal Detected Indication, LVTTL Output, Active High. 1

4 RD- Inverted Receiver Data Output, CML, AC coupled

5 RD+ Receiver Data Output, CML, AC coupled

6 V T Transmitter Power

CC

7 V T Transmitter Ground

EE

8 TX_DIS Transmitter Burst Enable Input, LVTTL, Active Low.

9 TD+ Transmitter Data Input, LVPECL or CML

10 TD- Inverted Transmitter Data Input, LVPECL or CML

F MS Mounting Studs 3

Note 1: LVTTL logic output, with internal 10KΩ pull-up resistor. Optical Signal-Detected: High.

Note 2: I2C interface, they should be pulled up with two 4.7-10KΩ resistors on the host board.

Note 3: The mounting studs are provided for transceiver mechanical attachment to circuit board. They

may also provide an optional connection of the transceiver to the equipment chassis ground. The

Input Saturation Power (O verload) SAT -3     dBm  
SD Assert Level SDA     -19 dBm  
SD De-assert Lev el SDD -35     dBm  
SD Hysteresis HYS 0.5   6 dB  
Parameter Accura cy Calibratio n No te
Temperatu re ±3°C Internal  
Voltage ±3% Internal  
Bias Curren t ±10mA Internal  
TX Power ±3dB Internal  
RX Power ±3dB Internal  
PinNo Name Function Notes
1 V R
EE
Receiver Ground  
2 V R
CC
Receiver Power  
3 RX_SD Receiver Signal Detected Indication, LVTTL Output, Active High. 1
4 RD- Inverted Receiver Data Output, CML, AC coupled  
5 RD+ Receiver Data Output, CML, AC coupled  
6 V T
CC
Transmitter Power  
7 V T
EE
Transmitter Ground  
8 TX_DIS Transmitter Burst Enable Input, LVTTL, Active Low.  
9 TD+ Transmitter Data Input, LVPECL or CML  
10 TD- Inverted Transmitter Data Input, LVPECL or CML  
F MS Mounting Studs 3

holes in the circuit board must be tied to chassis ground. It is not recommended that the mounting

studs be connected to signal ground.

Typical Application Circuit

FTAF-Bxx24-10DSxx 典型应用电路图
FTAF-Bxx24-10DSxx 典型应用电路图

Package Outline

FTAF-Bxx24-10DSxx 封装外形尺寸图
FTAF-Bxx24-10DSxx 封装外形尺寸图

Dimensions are in millimeters. All dimensions are ±0.1mm unless otherwise specified. (Unit: mm)

Ordering Information

Specifications

Part Number Data Rate Wavelength Temperature Reach

DDM

(Gbps) (nm) (°C) (km)

FTAF-B1324-10DS 2.5 Tx1310/Rx1550 -5~70 10 Y

FTAF-B1524-10DS 2.5 Tx1550/Rx1310 -5~70 10 Y

FTAF-B1324-10DSI 2.5 Tx1310/Rx1550 -40~85 10 Y

FTAF-B1524-10DSI 2.5 Tx1550/Rx1310 -40~85 10 Y

企业信息

企业信息
公司名 北亿纤通 | F-toneNetworks
地区 中国四川天府新区
服务区域 全球
企业电话 028-85255257
企业传真 028-85977702
企业手机 19081343401
Site https://www.f-tone.com
人事部 hr@f-tone.com
市场部 sales@f-tone.com
技术支持 support@f-tone.com

本产品为BIDI SFF光收发器产品线,详细信息,请联系我们的销售人员,谢谢!

Important Notice

Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.

The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.