BYCS-131X-10Dxx系列 10G SFP+ 1310nm LR 10km Transceiver V3.07 (2 SKU 商业级0~70°C + 工业级-40~85°C 802.3ae 10GBASE-LR SFF-8431 SFF-8472 DDM DFB 1310nm PIN Tx -8.2~0.5dBm Rx -14.4dBm 800mW Class 1 Laser) | F-tone Networks 北亿纤通100M-6G光模块, 25G企业级交换机, BYCS-131X-10Dxx系列 10G SFP+ 1310nm LR 10km Transceiver V3.07 (SFP+ LR 2 SKU 商业级+工业级), 光模块, 光纤配件-10 to 80C SFP, -128 dB/Hz, -14.4dBm, -40 to 85 deg C, -40~85°C, -8.2 dBm, -8.2~0.5dBm, <10μs Latency, +3.3V, 0 to 70 deg C, 0.35dB/km 1310nm, 0.5 dBm, 0.5dB Hysteresis, 0~70°C, 1.25G SFP 10km, 1.25G SFP DDM, 1.25G SFP Lead Free, 1.25G SFP RoHS, 1.25G SFP SFF-8472, 10 Gb/s, 10 Gbit/s, 10 Gigabit, 10 Gigabit Ethernet, 10 Gigabit SFP+, 10 km, 10-Pin, 10.3 Gbps, 10.3125 Gbps, 10.3125Gbps, 10.3Gbps, 100 Ohms differential, 100BASE-FX 商业级, 100BASE-FX 工业级, 100G BASE-LR4, 100G Ethernet Metro, 100G Ethernet Standard, 100G 数据中心, 100G电信网络, 100G长距光模块, 100Ω Differential, 100Ω 差分, 10G 10km SFP+, 10G Backbone, 10G Ethernet, 10G LR SFP+ Module, 10G SFP+, 10G SFP+ LR, 10G Transceiver, 10G 光模块, 10G 骨干网, 10Gb/s, 10GBASE SFP+, 10Gbase-LR, 10GBASE-LR Application, 10GBASE-LR Standard, 10GBASE-LR 典型应用, 10GbE, 10GbE SFP+, 10GbE SFP+ LR, 10km Reach, 10km Single Mode, 10km SMF, 10km@SMF, 1310 nm, 1310nm DFB, 1531.6nm F-toneNetworks, 1531.6nm TDLAS, 1531.6nm 北亿纤通, 1激光安全, 20 引脚 SFP+, 20-pin SFP+, 21 CFR 1040.10, 21 CFR 1040.11, 2kV ESD, 30dB SMSR, 38 Pin Card Edge, 802.3ae, 802.3ae 10GBASE-LR, 94V-0 阻燃级, AC CML, AC Coupled, AC 耦合, Advanced Firmware, All-metal Housing, AMAT 时钟光收发模块, Average launch power of OFF transmitter -30dBm, Backbone Network, BIDI 数字诊断, BYCS-131X-10D, BYCS-131X-10D Commercial, BYCS-131X-10D V3.07, BYCS-131X-10DI, BYCS-131X-10DI Industrial, BYCS-131X-10DI V3.07, BYCS-131X-10Dxx, BYCS-131X-10Dxx Series, BYCS-131X-10Dxx V3.07, BYCS-131X-10Dxx系列, BYCS-13L1-15Dxx (relative), BYCS-13L1-15Dxx系列 (relative), CE/FCC/RoHS, China 10G SFP+, China Manufacturer, China SFP+ Module, China 制造, Class 1 Laser, Class 1 Laser Product, CML electrical data, CML 电气数据, Commercial 0~70°C, Commercial Grade, Commercial-Grade Module, Common Mode Conversion, Computer Cluster, Computer Cluster Cross-connect, Custom High-speed Data Pipes, Custom SFP+, Customer System Encryption, Data Center, Data Center Interconnect, Datasheet V3.07, DDM with Internal Calibration, DDM 内部校准, DFB Laser, DFB Telecom Laser, DFB TOSA, DFB Transmitter, DFB 激光器, Differential Termination, Digital Diagnostic Monitoring, Digital Optical Monitoring, DMI Temperature ±3°C, DMI_Ibias ±10%, DMI_RX ±3dB, DMI_TX ±3dB, DMI_VCC ±0.08V, DOM, Domestic Substitute, Dynamic Range 12dB, E+S+C+L 波段, EMI 屏蔽, EMI 性能, Encryption, Encryption Storage, ER 3.5dB, ESD 2kV, ESD Threshold 2kV, ESD 静电防护, Extinction Ratio 3.5dB, F-tone 10G LR, F-tone 10G SFP+, F-tone 10G SFP+ LR Series, F-tone 1G SFP+, F-tone BYCS Series, F-tone BYCS-131X-10Dxx, F-tone Datasheet, F-tone Networks, F-tone SFP+ LR, F-tone Spec Sheet, F-tone V3.07, F-tone 全国产, F-tone 北亿纤通, F-tone 规格书, Flame Retardant, FS801 工业级宽温, FT-Y 热插拔电源, FTAF LVPECL, FTCS-1303-10DI (relative), FTCS-1312-10Dxx (relative), FTCS-1312-20xx (relative), FTQ2-HG-LR4 TDP 2.2dB, GR-468-CORE, Halogen Free, HBM 2kV, High-speed Data Pipes, High-speed Storage Area Networks, High-speed Storage Area Networks (SAN), Hot Pluggable, Human Body Model, Icc 350mA max, IEC 60825-1:1993, IEC 60825-1+A1+A2, IEEE 802.3ae, Industrial -40~85°C, Industrial Grade, Industrial Temperature, Industrial-Grade Module, Init Time 300ms, Internal Calibration, JESD22-A114-A HBM, Laser Notice No. 50, Laser Safety, LC connector, LC Duplex, LC 双工, Lead Free, Long Reach, LOS Assert -30dBm, LOS Assert 100μs, LOS Deassert -12dBm, LOS Deassert 100μs, Los Dessert -12dBm, Los Hysteresis 0.5dB, Low Power Consumption, LR Distance, Made in China, Metro Network, MIL-STD-883, MIL-STD-883 Method 3015.4, MOD_ABS, MOD_DEF0, ODM SFP+, OEM SFP+, OMA -12.6dBm, OMA -5.2 dBm, OMA -5.2dBm, OMA-TDP -6.2dBm, Optical Module, Optical Return Loss Tolerance, Optical Transceiver, ORL Tolerance 12dB, Pb-free, PECL/CML electrical data, PECL/CML 电气数据, PIN Detector, PIN Photo-detector, PIN ROSA, PIN 光电探测器, Pluggable Module, Power 1000mW max, Power 800mW, Power Consumption 1000mW max, Power Consumption 800mW, Power Supply 3.3V, Power Supply 3.3V Typ, Rate Select, REACH Compliant, REACH SVHC, Receive electrical 3dB upper cutoff 12.3GHz, Receiver Rate Select, Return Loss 12dB, Return Loss Tolerance 12dB, RIN -128dB/Hz, RIN12 OMA -128dB/Hz, RoHS 2.0, RoHS 2011/65/EU, RoHS compliant, RoHS无铅, RS0, RS1, Rx -14.4dBm, Rx 1260-1620nm, Rx 1620nm, Rx Damage 1.5dBm, Rx Overload 0.5dBm, Rx Reflectance -12dB, Rx Sensitivity -14.4dBm, Rx Sensitivity OMA -12.6dBm, RX_LOS, SAN, SAN 应用, SCL SDA, Serial ID Clock 100kHz, Server to Switch, Server-to-Switch, SFF-8431, SFF-8431 SFP+ electrical, SFF-8431 标准, SFF-8432, SFF-8432 Mechanical, SFF-8432 rev 5.0, SFF-8432 机械, SFF-8472 DDM, SFF-8472 Digital Diagnostic, SFF-8472 Rev10.2, SFI, SFI Electrical Specifications, SFI 电接口, SFP Plus, SFP+ 10G 1310nm 10km, SFP+ 10G 1310nm DUAL 10km, SFP+ 10G LR, SFP+ 10GBASE-LR, SFP+ Cage, SFP+ Cage and Connector System, SFP+ Form Factor, SFP+ Manufacturer, SFP+ Module, SFP+ Package, SFP+ Pin, SFP+ Transceiver, SFP+ 光模块, SFP+ 制造商, SFP+ 封装, Side Mode Suppression 30dB, Single 3.3V, SMSR 30dB, Spec Sheet V3.07, Standard 10G SFP+, Standard SFP+, Storage Area Network, Stressed -10.3dBm, Stressed eye jitter 0.3 UIp-p, Stressed Rx Sensitivity OMA -10.3dBm, Superior EMI Performance, Switch to Switch, Switch to Switch Interface, t_off 10μs, t_on 1ms, TDP 3.2dB, Telcordia GR-468, Telecom Network, Transmitter and Dispersion Penalty 3.2dB, Transmitter Rate Select, Tx 1310nm, TX Disable Assert 10μs, TX Disable Negate 1ms, TX Fault Assert 100μs, TX Fault Reset 10μs, Tx Power -8.2~0.5dBm, Tx_dis, TX_Fault, V0 Flame Retardant, Vcc 3.135~3.465V, Vcc 3.3V Typ, VccR, VccR VccT, VECP 2.2dB, VEER, VEET, Version 3.07, Vertical Eye Closure 2.2dB, Wide Temperature, 中国 10G SFP+, 交换机到交换机接口, 低功耗, 低烟无卤, 全金属外壳, 共模转换, 内部 AC 耦合, 加密存储, 可插拔模块, 国产10G光模块, 国产SFP+, 国产替代, 城域网, 差分终端, 数字光监控, 服务器到交换机, 消光比 3.5dB, 版本 3.07, 规格书 V3.07, 金属壳体, 集群互联, 高级固件, 高速数据管道
FT-WR系列 CXP Connector Assemblies 产品安装工艺说明 V3.06 (12× QFP 120Gb/s 高速并行 Cage+Housing 板级压接工艺 1.27mm/s 2940N Max 44.25×32.50mm PCB 6 PTH Ø2.20 0.37mm 成品孔 0.457mm #77 钻头 0.73mm 孔环 3.50mm TYP InfiniBand 100G 以太网 数据中心) | F-tone Networks 北亿纤通FT-WR系列 CXP Connector 安装工艺指南 (CXP Connector Assembly Process Guide), 光纤配件"A", "B", "C", (TYP), #77, ±0.10, ×, 0.70, 0.80, 1.27mm/s, 1.30mm, 1.40, 1.60, 10Gb/s, 12, 12-lane, 12.00mm, 12×, 12×10, 12×10G, 12×10Gbps, 120, 120G, 120Gb/s, 12x, 12x10G, 13.40mm, 14.40mm, 16.00mm, 19.00mm, 2, 2.40mm, 2.95mm, 2940N, 3.06, 3.50, 3.50mm, 32.50, 4.00mm, 44.25, 44.25×32.50mm, 5:1, 6, 8.00mm, A, A=0.37±0.05mm, A1, A1/B1/C1/D1, A21, A21/B21/C21/D21, Acceptance, Alignment, and, ANNULAR, Area, Array, Assemblies, Assembly, Automatic, Axis, B, B=0.457mm-#77, B1, B21, Back, Base, Bit, Board, C, C=0.73mm, C1, C21, Cage, CAGE+CONNECTOR, Cage2, center, Central, Channel, Circuit, Component, Connector, Control, Copper, Crimp, Crimping, CXP, D1, D21, Data, Datacenter, Datasheet, Design, DETAIL, DIM., Dimensioning, Drill, DRILLED, Drilling, Edge, Electro-Deposited, Equipment, Ethernet, F-tone, FINISHED, Fit, Flat, Force, FT-WR, FT-WR系列, Gb/s, Gbps, GD&T, Geometric, Guide, Hatch, Hatched, High, High-Speed, Hole, Housing, InfiniBand, Inspection, Installation, Insulation, Jig, Keep, lanes, Layer, Layout, Limit, Long, Lower, Manual, Manufacturing, Mass, Max, mm, Module, Mold, Mount, mounting, MSA, Networks, Ø0.37, Ø0.37±0.05, Ø2.20, Ø2.20±0.05, Out, Package, Pad, Parallel, PCB, Pin, Pitch, Plated, Plated-Thru, Plating, Positioning, Post, Press, Press-fit, Pressing, Printed, Process, Production, PTH, PTH(6), QC, QFP, Quality, RING, Routing, Series, short, Side, Size, Solder, Spacing, Speed, Standard, structure, Substrate, Support, Thickness, Through, Tolerancing, Tool, Tooling, Top, Total, Trace, Transceiver, Typ, Typical, U, U/V, Upper, V, V3.06, Via, Vias, View, Wall, 下模, 个, 个金属化通孔, 中心对称轴线, 产品安装工艺说明, 侧墙, 元器件, 典型孔间距, 初始钻孔, 初始钻孔直径, 剖面线, 剖面线区域, 剖面线禁布, 北亿纤通, 印制电路板, 印刷电路板, 压入, 压入治具, 压入治具平面结构, 压入流程, 压合, 压合装配, 压接, 压接上模, 压接上模设计, 压接上模设计注意事项, 压接力, 压接工艺, 压接操作方法, 压接机, 压接装配, 压接设备, 压接速度, 压装, 压装治具, 右对齐, 后墙, 品质, 品质控制, 器件, 器件禁布, 垂直方向, 垂直间距, 基材, 基材本体, 孔位, 孔位公差, 孔位定位公差, 孔壁, 孔壁电镀铜总厚度, 孔尺寸, 孔径, 孔环, 孔环宽度, 孔环焊盘, 安装, 安装孔, 安装定位, 安装定位孔, 安装工艺, 安装工艺说明, 定位孔, 定位对齐, 对称轴, 封装, 工艺, 工艺说明, 布局, 平面结构, 应用过程中, 引脚焊盘, 引脚焊盘孔径, 引脚间距, 形位公差, 总厚度, 总带宽, 成品镀通孔内径, 手动压接机, 承座, 承座平面结构, 推荐, 推荐孔尺寸, 推荐封装尺寸, 插柱, 收发器, 放大, 数据中心, 方向, 板, 板级尺寸, 板表层, 板边, 板边参考基准, 柱, 水平间距, 治具, 治具设计, 焊接, 焊盘, 焊盘宽度, 焊盘阵列, 焊端, 焊端区域, 焊端宽度, 焊端高度, 环形焊盘, 生产, 电镀, 电镀通孔, 电镀铜, 短路, 禁器件, 禁器件和走线, 禁布区, 禁布规则, 第一步：产品放在承座上, 第一步：工位就位, 第二步：压入治具将产品压入, 第二步：压入装配, 笼, 笼式连接器, 系列, 组件禁布区, 细节放大, 细节视图, 绝缘基材, 自动压接机, 表层, 表层走线, 装配过程中, 规范, 质量控制, 走线, 走线区, 走线禁布, 路, 路并行, 边对齐, 过孔, 过孔阵列, 连接器, 连接器限位边, 通道, 量产, 金属化通孔, 钻头, 钻头编号, 钻孔, 镀通孔, 长连接器, 防止短路, 限位, 限位孔, 限位边, 顶部, 验收, 高速并行
FTGA-12TR851X-02I 12路 10.3125Gbps 850nm 多模 LGA 压接式并行光模块 (MT/UPC 散纤 -55~85°C) | F-tone Networks 北亿纤通100M-6G光模块, 10G光模块, FTGA-12TR851X-02I系列-11dBm, -4dBm, -55, -55℃~85℃, 0xA0, 0xA1, 10.3125Gbps, 10.3Gbps, 1000V, 100m@10.3125Gbps, 100m@OM3, 100Ω, 10G, 10Gb/s, 1100mA, 12-Channel, 12路并行10G, 12路并行光模块, 12通道并行, 1600mV, 200-pin电连接器, 200mV, 200mV~1600mV, 200pin, 200pin连接器, 24mm×20.3mm×4mm, 24芯MT, 24芯MT/UPC, 24芯MT接口, 24芯MT散纤, 2dBm, 3.5W, 4dB, 500V, 840nm, 85°C, 850nm, 850nm多模, 860nm, ALERTN, Array, DI[1:12]N, DI[1:12]P, DO[1:12]N, DO[1:12]P, ER, ESD, FTGA-12TR851X-02I, GNDR, GNDT, Grid, HBM, I2C, InfiniBand, Infiniband互连, Land, LGA, LGA压接, LGA压接光模块, LGA压接式, LGA封装, LGA封装光模块, LGA并行光模块, LGA弹性压接, LGA弹性接触, LVPECL, MT/UPC, OM3, Optical, Parallel, RESETN, RXEN, SCL, SD, SDA, SFP+等效, Supercomputer, to, TXEN, VCCR33, VCCT33, VCSEL, 中心波长, 低温告警, 内部上拉10K, 内部温度监控, 压接式LGA, 宽温光模块, 封装尺寸, 封装尺寸24mm×20.3mm×4mm, 尾纤72mm, 工业级并行光模块, 工作电流1100mA, 差分信号输入电压, 差分输入匹配阻抗, 平均发射光功率, 平行光模块, 并行光模块, 接收灵敏度, 散纤, 最大功耗3.5W, 机柜内互连, 机柜间互连, 欠压告警, 消光比, 温度监控, 电压监控, 短程多通道并行数据通信, 短程并行, 过压告警, 饱和光功率, 高温告警, 高温壳温, 高速互连, 高速并行光模块
FTGA-24TR851X-02DI 24路 10.3125Gbps 850nm 多模 LGA 压接式并行光模块 (MT/UPC -55~85°C) | F-tone Networks 北亿纤通100M-6G光模块, 10G光模块, FTGA-24TR851X-02DI系列-10dBm, -55, -55℃~85℃, -5dBm, 0xA0, 0xA1, 10, 10.3125Gbps, 10.3Gbps, 1000V, 100m@OM4, 100m@OM4传输, 10G, 10Gb/s, 10GbE, 10G每通道二十四路并行, 2.5W, 200-pin, 200-pin电连接器, 200pin, 200pin连接器, 24-Channel, 24×10G, 24路并行10G, 24路并行光模块, 24通道并行, 2dBm, 3.3V, 33.4mm×20mm×4mm, 48芯MT, 48芯MT/UPC, 4dB, 500V, 6.2W, 70m@OM3, 8.8W, 840nm, 85°C, 850nm, 850nm多模, 860nm, AC, AC耦合, Array, CML, CML电平, Connector, DDMI, Din[1:24]N, Din[1:24]P, DNC, Dout[1:24]N, Dout[1:24]P, ER, ESD, Ethernet, FTGA-24TR851X-02DI, Gigabit, GND, Grid, HBM, I2C, InfiniBand, Infiniband互连, Land, LGA, LGA压接, LGA压接光模块, LGA压接式, LGA封装, LGA封装光模块, LGA并行光模块, LGA弹性压接, LGA弹性接触, MPO/MT, MT/UPC, NIC, NTC, OM3, OM4多模, Optical, Parallel, Rx_dis, SCL, SD, SDA, SFP+等效, Supercomputer, Telemetry, to, Tx_dis, VCC, VCSEL, 中心波长, 交流CML, 交流耦合电容, 典型功耗6.2W, 内部集成耦合电容, 压接式LGA, 外壳温度监控, 宽温光模块, 封装尺寸, 工业级并行光模块, 平均发射光功率, 平行光模块, 并行光模块, 接收光功率监控, 接收灵敏度, 数字诊断监控, 数字遥测, 最大功耗8.8W, 机柜内互连, 机柜间互连, 模块温度监控, 消光比, 温度监控, 电压监控, 短程多通道并行数据通信, 短程并行, 通道寄存器, 通道控制, 饱和光功率, 高温壳温, 高速互连, 高速并行光模块
Board to Board Connectors – 插座(Receptacles)零件编号F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 插头零件编号与镀层选项F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 堆叠高度与型号对照表F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 尺寸规格F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 插座(Receptacles)零件编号F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 插头零件编号与镀层选项F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 电气性能F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 材料与机械性能F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 堆叠高度与型号对照表F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 产品概述F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 尺寸规格F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 电气性能F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 材料与机械性能F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
Board to Board Connectors – 产品概述F-tone连接器, 板对板连接器, 连接器10Gb/s, BGA连接器, F-tone, RoHS, Telcordia认证, 板对板, 高速连接器
