FT-WR系列 CXP Connector Assemblies 产品安装工艺说明 V3.06 (12× QFP 120Gb/s 高速并行 Cage+Housing 板级压接工艺 1.27mm/s 2940N Max 44.25×32.50mm PCB 6 PTH Ø2.20 0.37mm 成品孔 0.457mm #77 钻头 0.73mm 孔环 3.50mm TYP InfiniBand 100G 以太网 数据中心) | F-tone Networks 北亿纤通FT-WR系列 CXP Connector 安装工艺指南 (CXP Connector Assembly Process Guide), 光纤配件"A", "B", "C", (TYP), #77, ±0.10, ×, 0.70, 0.80, 1.27mm/s, 1.30mm, 1.40, 1.60, 10Gb/s, 12, 12-lane, 12.00mm, 12×, 12×10, 12×10G, 12×10Gbps, 120, 120G, 120Gb/s, 12x, 12x10G, 13.40mm, 14.40mm, 16.00mm, 19.00mm, 2, 2.40mm, 2.95mm, 2940N, 3.06, 3.50, 3.50mm, 32.50, 4.00mm, 44.25, 44.25×32.50mm, 5:1, 6, 8.00mm, A, A=0.37±0.05mm, A1, A1/B1/C1/D1, A21, A21/B21/C21/D21, Acceptance, Alignment, and, ANNULAR, Area, Array, Assemblies, Assembly, Automatic, Axis, B, B=0.457mm-#77, B1, B21, Back, Base, Bit, Board, C, C=0.73mm, C1, C21, Cage, CAGE+CONNECTOR, Cage2, center, Central, Channel, Circuit, Component, Connector, Control, Copper, Crimp, Crimping, CXP, D1, D21, Data, Datacenter, Datasheet, Design, DETAIL, DIM., Dimensioning, Drill, DRILLED, Drilling, Edge, Electro-Deposited, Equipment, Ethernet, F-tone, FINISHED, Fit, Flat, Force, FT-WR, FT-WR系列, Gb/s, Gbps, GD&T, Geometric, Guide, Hatch, Hatched, High, High-Speed, Hole, Housing, InfiniBand, Inspection, Installation, Insulation, Jig, Keep, lanes, Layer, Layout, Limit, Long, Lower, Manual, Manufacturing, Mass, Max, mm, Module, Mold, Mount, mounting, MSA, Networks, Ø0.37, Ø0.37±0.05, Ø2.20, Ø2.20±0.05, Out, Package, Pad, Parallel, PCB, Pin, Pitch, Plated, Plated-Thru, Plating, Positioning, Post, Press, Press-fit, Pressing, Printed, Process, Production, PTH, PTH(6), QC, QFP, Quality, RING, Routing, Series, short, Side, Size, Solder, Spacing, Speed, Standard, structure, Substrate, Support, Thickness, Through, Tolerancing, Tool, Tooling, Top, Total, Trace, Transceiver, Typ, Typical, U, U/V, Upper, V, V3.06, Via, Vias, View, Wall, 下模, 个, 个金属化通孔, 中心对称轴线, 产品安装工艺说明, 侧墙, 元器件, 典型孔间距, 初始钻孔, 初始钻孔直径, 剖面线, 剖面线区域, 剖面线禁布, 北亿纤通, 印制电路板, 印刷电路板, 压入, 压入治具, 压入治具平面结构, 压入流程, 压合, 压合装配, 压接, 压接上模, 压接上模设计, 压接上模设计注意事项, 压接力, 压接工艺, 压接操作方法, 压接机, 压接装配, 压接设备, 压接速度, 压装, 压装治具, 右对齐, 后墙, 品质, 品质控制, 器件, 器件禁布, 垂直方向, 垂直间距, 基材, 基材本体, 孔位, 孔位公差, 孔位定位公差, 孔壁, 孔壁电镀铜总厚度, 孔尺寸, 孔径, 孔环, 孔环宽度, 孔环焊盘, 安装, 安装孔, 安装定位, 安装定位孔, 安装工艺, 安装工艺说明, 定位孔, 定位对齐, 对称轴, 封装, 工艺, 工艺说明, 布局, 平面结构, 应用过程中, 引脚焊盘, 引脚焊盘孔径, 引脚间距, 形位公差, 总厚度, 总带宽, 成品镀通孔内径, 手动压接机, 承座, 承座平面结构, 推荐, 推荐孔尺寸, 推荐封装尺寸, 插柱, 收发器, 放大, 数据中心, 方向, 板, 板级尺寸, 板表层, 板边, 板边参考基准, 柱, 水平间距, 治具, 治具设计, 焊接, 焊盘, 焊盘宽度, 焊盘阵列, 焊端, 焊端区域, 焊端宽度, 焊端高度, 环形焊盘, 生产, 电镀, 电镀通孔, 电镀铜, 短路, 禁器件, 禁器件和走线, 禁布区, 禁布规则, 第一步：产品放在承座上, 第一步：工位就位, 第二步：压入治具将产品压入, 第二步：压入装配, 笼, 笼式连接器, 系列, 组件禁布区, 细节放大, 细节视图, 绝缘基材, 自动压接机, 表层, 表层走线, 装配过程中, 规范, 质量控制, 走线, 走线区, 走线禁布, 路, 路并行, 边对齐, 过孔, 过孔阵列, 连接器, 连接器限位边, 通道, 量产, 金属化通孔, 钻头, 钻头编号, 钻孔, 镀通孔, 长连接器, 防止短路, 限位, 限位孔, 限位边, 顶部, 验收, 高速并行
FTRS-Cxxxx-xxDxx 军品级 1×9 双列直插 10 引脚光收发器模块 V3.06 (AMMN31LP99FLI 核心芯片 0.1~1.25 Gbps 850/1310/1550nm + CWDM 18波 100m/2km/10km/40km/50km -40~+85°C 3.3V LC/FC/CWDM 12mm 全金属 机载/舰载/高海拔) | F-tone Networks 北亿纤通FTRS-Cxxxx-xxDxx 系列 军品级 1×9 光收发器模块 (Military 1x9 Transceiver Module), Optical Transceivers-12, -19, -29, -34, -40, -40~+85, -40~+85°C, -5, -55, -55~+85, -55~+85°C, -5dBm, (Optional), /, <10, <10-100, +, +260°C, +85, +85°C, ×, =, ≤, ≥, 0.1, 0.1-1.25, 0.1~1.25, 0.1~1.25G, 0.1G, 0.1G-1.25G, 0.1Gbps, 0.51mm, 0.8, 02, 1.25, 1.25G, 1.3mm, 1.5, 1.5-3.5, 1.5~3.5, 1.52mm, 1.6/2.0/2.2/2.5mm, 1.6mm, 1×9, 10, 10-Pin, 10.68mm, 100, 100m, 100M/1G, 100Mbps, 10KM, 11.68mm, 12.29mm, 120mA, 1270, 1270-1600, 1270-1600nm, 1270~1600, 1270~1600nm, 1270nm, 12mm, 13, 1310/1550, 1310/1550nm, 1310&1550, 1310&1550nm, 1310nm, 15, 15.24mm, 1550nm, 1600, 1600nm, 160mA, 18, 18-wave, 18wave, 1x9, 2, 2.0, 2.0mm, 2.25, 2.2mm, 2.5mm, 2.95mm, 260C, 2km, 3.06, 3.18mm, 3.3V, 3.5, 3mm, 40, 400-600, 40KM, 4mm, 50, 50km, 50Ω, 70/120mA, 70mA, 8, 8.61mm, 818-2000, 85, 850/1310/1550, 850/1310/1550nm, 850nm, 85nm, 9.0mm, 9.14mm, 93-1987, 97-1987, All-Metal, Altitude, AMMN31LP99, AMMN31LP99FLI, Amplifier, Amplitude, Anti-vibration, Anti-Vibration, Area, Assert, Assignment, Avionics, Avionics/Naval/Altitude, Bitrate, C, C:商业级, C/I/M, Cable, Card, Channel, Chassis, Chip, CML, Compact, Connector, Control, Cross, Current, CWDM, Cxx, D, Damp, Data, Datasheet, dB, dBm, DC, DC-1.25, DC-1.25G, DC~1.25, DC~1.25Gbps, Deassert, Definition, Design, Detect, Detector, Differential, DIP, DIP-10, Disable, Distance, Driver, EMI, Enable, Environment, Environmental, ER, Ethernet, Extinction, F-tone, Factor, FC, Fiber, Flat, Footprint, Form, Front-end, FTRS, FTRS-Cxxxx, FTRS-Cxxxx-xxD, FTRS-Cxxxx-xxDxx, GB, Gbit/s, Gbps, Gigabit, GND, Grade, Heat, Height, High, Hole, Housing, Humidity, HYS, Hysteresis, I, I:工业级, I/O, ICC, Information, Input, Interface, Keep, Keep-out, km, LA, Land, Laser, Layout, LC, LD, Level, Limiting, LOS, Loss, LP99, LP99FLI, LVCMOS, LVDS, LVPECL, LVTTL, M, M:, M:军用级, M2, M2×3mm, M2×4mm, M2x3, M2x4, Mbps, Metal, Military, Mini, Miniaturization, Miniaturized, MN, MN:迷你型封装, Module, Moisture, Mount, mounting, Multi-Rate, MV, Naval, Networks, nm, of, ohm, ohms, Optical, Optional, Order, Ordering, ORL, Out, Output, Package, Pattern, PCB, PECL, Photodetector, Pigtail, Pin, Plug-in, PO, Port, Power, Range, Ratio, RD, RD-, RD+, RD+/RD-, Receiver, Receptacle, Recommended, Reliability, Resistance, Resistant, Return, Rev, RL, RX, Screening, Screw, SD, SD/LOS, SDAS, SDDA, SDH, SDOFF, SDON, Sensitivity, Shell, Signal, Single, Size, Small, SONET, SONET/SDH, Spectral, Spring, Stance, Storage, structure, Suffix, Supply, Switch, TA, TD, TD-, TD+, TD+/TD-, TDIS, Temperature, Termination, Test, Testing, Thickness, Through, Through-hole, THT, TIA, Time, to, Top, Transceiver, Transimpedance, Transmission, Transmit, tSDAS, tSDDA, TSOLD, TSTG, TX, TX_Disable, TX_Enable, Typ, Typical, V, V3.06, VAMP, VCC, VCCRX, VCCTX, VD, VEERX, VEETX, Vibration, View, Voltage, Vp-p, VTD, VTEN, Washer, Wave, Wavelength, WDM, Wideband, λ, μs, φ2, 交换机, 以太网, 仲裁时间, 信号丢失, 信号丢失输出, 信号检测, 信号检测仲裁时间, 信号检测仲裁电平, 信号检测失裁时间, 信号检测失裁电平, 信号检测引脚, 信号检测滞后, 信号检测输出, 光口, 光回波损耗, 光接收前端, 光接收灵敏度, 光模块, 光纤通道, 全金属外壳, 全金属结构, 典型, 军品级, 军品级光模块, 军品级收发器, 军用光模块, 军用收发器, 军用核心芯片, 军用温度, 军用环境, 军用级, 军用级温度, 军用级筛选, 军用级筛选及环境试验, 前端, 加尾纤, 北亿纤通, 北亿纤通科技, 单电源, 单电源供电, 厚度, 双列直插, 双列直插封装, 发送使能, 发送使能信号, 发送使能信号输入, 发送关断, 发送关断信号, 发送关断信号输入, 发送端地, 发送端电源, 可选, 可靠性, 商业级, 国标, 国标螺钉, 圆头, 圆头螺钉, 垫片, 垫片+弹垫, 多速率光模块, 大功率, 失裁时间, 存储温度, 安装, 宽带接收, 宽带接收器, 封装, 封装形式, 小型化, 尾纤, 尾纤可选, 尾纤接口, 尾纤模块, 工业温度, 工业级, 工业级温度, 差分信号, 差分信号引脚, 差分数据, 差分数据信号, 差分终端, 差分终端匹配, 差分输入, 差分输入电压, 差分输出, 差分输出幅度, 布局, 平垫圈, 引脚, 引脚光模块, 引脚收发器, 弹垫, 弹簧垫圈, 抗, 抗振动, 抗振动设计, 抗电磁干扰, 接口, 接口形式, 接收灵敏度, 接收端地, 接收端电源, 控制信号传输, 推荐焊盘, 插拔, 插板, 插板或机箱, 收发器, 数字光通信, 数字光通信系统, 数据信号检测, 机箱, 机载, 机载/舰载/高海拔, 机载光模块, 机载环境, 板厚, 板厚支持, 标准, 核心芯片, 模块, 模块安装, 波, 波可选, 波长, 波长可选, 波长接口, 温度, 温度等级, 温度适应性强, 滞后, 焊接温度, 环境试验, 环境适应性, 禁止布线, 系列, 紧凑型光模块, 耐湿热, 舰载, 舰载光模块, 螺丝, 螺钉, 订购信息, 距离, 跨阻放大器, 输出幅度, 迷你型, 迷你型光模块, 迷你型封装, 通道, 速率, 速率段, 金属外壳, 金属结构, 限幅放大器, 顶视图, 驱动, 高度, 高海拔, 高海拔光模块, 高海拔环境
