10G光模块
10G速率光模块
FTGA-12TR8525G-02I 压接式 LGA 封装 12 路并行光收发一体模块 V3.06 (12×25.78125Gbps 多模 850nm VCSEL 70m@OM3 100m@OM4 MT/APC 斜8°研磨 38×24×5.5mm -55~+85°C 超宽温 CDR 切换 I2C 0xA0 数字监控 12通道光功率) | F-tone Networks 北亿纤通
10G光模块, FTGA-12TR851X-02I系列, FTGA-12TR8525G-02I系列 压接式LGA封装12路并行光收发一体模块 (12×25.78125G 多模 850nm MT/APC 斜8° -55~+85°C 38×24×5.5mm)-3dBm, -55 to +85, -55 to 100, -55°C, -55°C to +85°C, -55~+100, -55~+85, -55C, -55C to +85C, -9dBm, +85°C, +85C, 0x22-0x39, 0xA0, 0xA1, 10.3125 Gbps, 10.3125G, 100 ohm Differential, 12 ch 25G, 12 Channel Parallel, 12 channels 25G, 12 x 25.78125 Gbps, 12 x 25G, 12 路并行, 12 路并行光收发, 12 路并行模块, 12 通道 25G, 12 通道 VCSEL, 12-Ch 25G, 12-Channel 25.78G, 12-Channel Data, 12-Channel Parallel, 12-Channel Parallel 25G, 12-Channel VCSEL, 12-Channel x 25.78G, 12ch 25.78G, 12x25G, 200 Pin Connector, 200 Pin Header, 200 Pin Socket, 200 引脚, 200-Pin Header, 200-Pin LGA, 200-Pin Socket, 24 Core MT, 24 Fiber MT, 24 Fiber MT Ferrule, 24 芯 MT 插芯, 24-Core MT, 25.78 Gbps, 25.78 Gbps NRZ, 25.78125, 25.78125 Gbps, 25.78G, 25G NRZ, 25Gbps, 2800 mA, 2800mA, 2800mA Current, 3 dB ER, 3.3 V, 3.30V, 3.3V Power, 3.3V Single Supply, 3.3V 单电源, 309.375 Gbps, 3dBm, 5E-5, 70 100m, 70 to 100m, 70-100m, 70/100m, 8 Degree Angle, 8 度斜面, 8.5-10.3125Gbps, 8.5G, 8.5G to 10.3125G, 8.5G-10.3125G, 8.5Gbps, 8° Angle, 850 nm, 850 nm Center, 850 nm CW, 850 nm VCSEL, 850-nm, 850nm CW, 9 Watt, 9W, AC CML, AC-Coupled CML, AI Compute, AI Computing, AI GPU, AI GPU Interconnect, AI Interconnect, AI Server, AI 算力, AI 算力互联, Alarm Indicator, Alarm Signal, ALERTN Pin, Angled PC, Angled Physical Contact, APC MT, APC Polish, APC 研磨, ASIC Connection, ASIC Interconnect, ASIC Optical, ASIC 互连, BER <= 5e-5, BER 5E-5, BER<5E-5, BER<5x10-5, Bit Error Rate, Cabinet Internal, Cable Length 100m, Cable Length 70m, Case Temperature -55, Case Temperature 85, CDR Enable, CDR Enable Pin, CDR Function, CDR Switching, CDR 切换, CDR_EN, CDR_EN Pin, Ch1 Power, Ch1-Ch12 Power, Ch12 Power, Channel 1 Power, Channel 12 Power, Channel Power Monitor, Channel Power Monitor Register, CML Level, CML 电平, Current 2800mA, DDMI 监控, Differential 100 ohm, Differential 100Ω, Differential CML, Differential ESD, Differential Impedance, Differential Pair, Differential Signal, Digital Monitoring, Dual Rate, Dual Rate Support, Embedded Module, Embedded Transceiver, ER 3dB, ESD 1000V, ESD 500V, ESD Hardened, ESD 防护, Extended Temperature, Extreme Temperature, Eye Mask, FEC Margin, FPGA Communication, FPGA Connection, FPGA Interconnect, FPGA Optical, FPGA Transceiver, FPGA 互连, FTGA, FTGA 12 Channel, FTGA 12 Parallel, FTGA 12 路, FTGA 12 路并行, FTGA 12-Channel, FTGA 12-Channel Parallel, FTGA Datasheet, FTGA Embedded Module, FTGA Parallel Optical, FTGA Parallel Transceiver, FTGA Series, FTGA Series Datasheet, FTGA Series V3.06, FTGA Spec Sheet, FTGA Tech Spec, FTGA V3.06, FTGA 并行光收发, FTGA 并行光模块, FTGA-12, FTGA-12TR8525G, FTGA-12TR8525G-02I, FTGA-12TR8525G-02I V3.06, Hardened Grade, High Temp Case, HPC AI, HPC Cluster, HPC Connection, HPC Data Center, HPC GPU, HPC Supercomputer, I2C 0xA0, I2C 0xA1, I2C Address 0xA0, I2C Address 0xA1, I2C 接口, I2C 通信, Icc 2800mA, Impedance 100 ohm, Impedance 100Ω, Industrial Wide Temp, Inter-cabinet, Inter-cabinet Interconnect, Inter-rack, Inter-rack Connection, Intra-cabinet, Intra-cabinet Connection, Intra-cabinet Interconnect, Intra-rack, LGA 200, LGA 200 Pin, LGA 200 Pin Connector, LGA 200 引脚, LGA 200-Pin, LGA 200pin, LGA Assembly, LGA Board-mounted, LGA Embedded, LGA Embedded Module, LGA Land Grid Array, LGA On-board, LGA Package, LGA Press-fit, LGA Press-fit Module, LGA SMT Solderless, LGA Solder Pads, LGA Solderless, LGA 压接式, LGA 封装, LGA 嵌入式, LGA 嵌入式模块, LGA 弹片, LGA 板载, LGA 板载光模块, LGA 焊盘, LGA 装联, LGA 装配, Logic Level, MARGIN, Margin 20%, Mask Margin, Mask Test Pass, Memory Map, MemoryMap, MemoryMap 0x04, MemoryMap 0x05, MemoryMap 0x22, MemoryMap 0x23, Military Temp, MM Parallel, MMF Parallel, MT 24, MT 24 Core, MT 24 Fiber, MT 24-Core, MT 24-Fiber, MT 24芯, MT 8 degree, MT 8 度, MT 8-degree, MT 8°, MT APC, MT Connector, MT Plug, MT Socket, MT 套圈, MT 插芯, Multi-channel Data, Multi-channel Parallel, Multi-mode Parallel, Multi-rate CDR, Multi-rate Support, Multimode 850nm, Multimode Parallel, Multimode VCSEL, NRZ Signal, NRZ 信号, NRZ 调制, PAM4 Modulation, Parallel 12, Parallel Channel, Parallel Data Communication, Parallel Optical, Parallel Optical Module, Pin Press-fit, Post FEC, Post-FEC, Power 3.3V, Power 9 Watt, Power 9W, Power Budget 9dB, Power Supply 3.3V, PRBS Pattern, PRBS31, PRBS31 Pattern, Pre FEC, Pre-FEC, Press-fit Assembly, Press-fit Contact, Press-fit LGA, Press-fit Module, Press-fit Optical, Press-fit Press-in, Press-fit SMT, Press-fit Tooling, Press-fit Transceiver, Pseudo Random, Pseudorandom, Rack to Rack, Rack-to-rack, Rate Switch, Register Address, Register Map, Reset, RX Enable, Rx Los Pin, RX Saturation, Saturation Power, SD Pin, Sensitivity -9 dBm, Serial Clock, Serial Data, Short Range, Short Range Interconnect, Short Range Parallel, Signal Detect Pin, Signal Loss, Single Channel 25G, Single Power Supply, Single Supply, Solderless Assembly, Solderless Install, Solderless Module, Solderless Mount, Solderless Press, Storage Temp, Storage Temperature, Supercomputer Interconnect, Supercomputing, Supply Voltage, Temp Monitor, Transceiver Module, Tstg -55 to 100, Tx Disable Function, TX Enable, TX Power -3 to 3 dBm, TXEN RXEN, Vcc 3.3V, VCSEL 12 通道, VCSEL 12-Channel, VCSEL 阵列, Voltage Monitor, Voltage Monitoring, Wavelength 850nm, Wide Temperature, Zin 100Ω, Zout 100Ω, 中心波长 850nm, 串行数据, 串行时钟, 交流 CML, 光收发一体, 军标温度, 冲击, 功率预算, 压接式, 压接式 SMT, 压接式 Transceiver, 压接式光收发一体模块, 压接式光模块, 压接式无焊接, 双速率, 发射使能, 发射光功率, 发射功率, 发射功率 -3~3dBm, 告警指示, 复位, 多通道并行, 失光告警, 寄存器映射, 工业级宽温, 差分 CML, 差分对, 差分阻抗, 并行数据通信, 弹片压接, 弹片压接式, 弹片接触, 振动, 接收使能, 接收功率, 数字监控, 斜 8 度, 斜8度, 斜8度角, 斜8度角 APC, 斜面物理接触, 无焊接安装, 无焊接模块, 时钟数据恢复, 机柜间, 极端温度, 湿度, 灵敏度 -9dBm, 眼图, 短程, 短程互连, 误码率, 超宽温, 超算, 超级计算机, 超级计算机机柜间, 通道光功率监控, 速率切换, 逻辑电平
FTOA-8H-OA-Pxx-xx 800G OSFP112 Passive DAC 高速铜缆 (0.5/1/1.5/2/3米 30/28/26 AWG 112Gb/s PAM4 IEEE 802.3ck) | F-tone Networks 北亿纤通
10G光模块, FTOA-8H-OA-Pxx-xx 800G OSFP112 DAC系列, Optical Transceivers, 光纤配件-19.75dB, -40-80°C, 0-70°C, 0.5m, 1.5M, 100, 100±10Ω, 100±5Ω, 100G, 100Ω, 10MΩ, 10ps/m, 112G, 112G-PAM4, 112Gb/s, 125N, 16, 180°, 1m, 2-wire, 20, 26AWG, 28AWG, 2M, 2x8, 3.3V, 30/28/26, 300V, 30AWG, 30N, 35dB, 3m, 40N, 48h, 5.0, 50, 500h, 6ms, 70mΩ, 8, 800G, 800Gbps, 802.3ck, 8x, 90N, AI, AI/ML, and, Assembly, Attach, AWG, Backwards, Bandwidth, Base, Bend, Cable, Cage, Card, center, Channel, Class, Cloud, Cluster, Cold, Common-mode, Communication, Compatible, Compliance, Computing, Contact, Conversion, Copper, crosstalk, Cycles, Cycling, DAC, Data, DCI, Deviation, Dielectric, Differential, Direct, Durability, Ecosystem, EIA-364-17C, EIA-364-20, EIA-364-21, EIA-364-23, EIA-364-26, EIA-364-27B, EIA-364-28E, EIA-364-32D, EIA-364-35, EIA-364-38B, EIA-364-41C, electrical, End, EoR, Ethernet, Extraction, F-tone, Factor, Finned, Flex, Flowing, Form, FTOA-8H-OA, FTOA-8H-OA-P01-A, FTOA-8H-OA-P015-B, FTOA-8H-OA-P02-B, FTOA-8H-OA-P02-C, FTOA-8H-OA-P03-C, FTOA-8H-OA-PA5-A, FTOA-8H-OA-Pxx-xx, Gas, GPU, High, High-Speed, Hot, HPC, Hyperscale, I2C, IEEE, IEEE802.3ck, II, Impedance, in, Insertion, Insulation, INT/RSTn, Interconnect, Interface, Intra, lane, Leaf, Legacy, Length, Level, Life, Link, Loss, low, LPWh/PRSn, Maximum, MDNEXT, Mechanical, Mixed, Module, MSA, Networks, Non-Powered, of, ohm, Operating, OSFP, OSFP_MSA, OSFP_Specification_Rev5_0, OSFP112, Paddle, Pair, Pairs, pam4, Passive, per, Performance, Plug, pluggable, plugging, Power, QSFP, QSFP112, Rack, Resistance, Retention, Return, Rev, RoHS, Router, Row, RX1n, RX1p, RX2n, RX2p, RX3n, RX3p, RX4n, RX4p, RX5n, RX5p, RX6n, RX6p, RX7n, RX7p, RX8n, RX8p, Salt, SCC11, SCC22, SCD11, SCD21-SDD21, SCD22, SCL, SDA, SDD11, SDD21, SDD22, Serial, Server, SFF-8636, Shock, Signal, Signals, Single, Skew, Specification, Speed, Spine, Spine-Leaf, Spraying, Storage, string, Switch, SWITCH/Router, Temp, Temperature, Thermal, to, Top, ToR, Transition, Twin-port, Twinax, two-line, TX1n, TX1p, TX2n, TX2p, TX3n, TX3p, TX4n, TX4p, TX5n, TX5p, TX6n, TX6p, TX7n, TX7p, TX8n, TX8p, Upgrade, V3.06, VCC, Vibration, Voltage, Withstanding, 北亿纤通
FTCO-8H-CO-Pxx 800G Twin-port OSFP to OSFP Passive Copper Cable DAC 高速铜缆 (0.5/1/1.5/2/3米 30/28/26 AWG Finned Top 0.1W) | F-tone Networks 北亿纤通
10G光模块, FTCO-8H-CO-Pxx 800G OSFP DAC系列, Optical Transceivers, 光纤配件-40, (Halogen, (Lead, <2, <30N, <40N, +85°C, ±25mm, ±50mm, ≥8.25dB, 0, 0-70°C, 0.1, 0.1W, 0.5, 0.5A, 0.5m, 0.5W, 1.5M, 100G, 100G-PAM4, 10x, 125N, 16, 180°, 1m, 2, 2.10, 2.5, 26.56, 26AWG, 28AWG, 2M, 2x, 2x400G, 2x400Gb/s, 2x8, 3, 3.135V, 3.3V, 3.465V, 30AWG, 30V, 364-41, 3m, 5-85%, 50, 60-pin, 70°C, 8, 8-Channel, 800G, 800Gb/s, 8K, 9.84, 90N, AI, AI/ML, Assembly, Attach, Bend, Bulk, C, Cable, Capacitance, Case, center, ch, Channel, Cloud, Cluster, compliant, Contact, Control, Copper, Cost-Effective, Cycles, DAC, DACCable, DACCopper, Data, DC, Deep, Definition, Differential, Dimensions, Direct, Durability, Effective, Efficient, EIA, End, Energy, ERL, Ethernet, F-tone, fabric, Factor, Finned, Finned-top, Flex, Force, Form, Free, Free), ft, FTCO-8H-CO, FTCO-8H-CO-P01, FTCO-8H-CO-P015, FTCO-8H-CO-P02, FTCO-8H-CO-P03, FTCO-8H-CO-PA5, FTCO-8H-CO-Pxx, GHz, Halogen, Head, HF, High, High-Speed, Hot, Hot-Pluggable, HPC, Humidity, Hyperscale, Inference, InfiniBand, Inline, Input, Interconnect, Jacket, lane, Latch, Latency, Layout, Lead, Leaf, Learning, Length, LF, Link, LLCR, Loss, low, Lowest, Lowest-Cost, Mating, Max, meters, Modulation, Module, MSA, msa.org, NDR, Near, Networks, NVIDIA, Octal, OD, of, ohms, Operating, OSFP, OSFP-to-OSFP, P2P, Pad, Pairs, pam4, Passive, PCB, PCC, per, Pin, Plug-and-Play, pluggable, Point-to-Point, Polyvinylchloride, Power, Pre-terminated, PVC, Quantum-2, Radius, Relative, Retention, Return, Rev, RoHS, SDD12, SDD21, SFF-8636, SFF-8665, Signals, Single, Small, Spectrum-4, Speed, Spine, Spine-Leaf, Storage, Strength, Supply, Switch, Switch-to-Switch, Temperature, to, Tolerance, Top, training, Twin-port, Type, Ultra, Un-mating, Unplug/Plug, V3.06, Video, Voltage, Watt, Wire, Zero, 北亿纤通
FTCO-8H-SR4 800G Twin-port OSFP 2xSR4 多模 100m 光模块 (8 通道 100G-PAM4 850nm VCSEL 2xMPO-12 APC 14W CMIS 4.0) | F-tone Networks 北亿纤通
10G光模块, FTCO-8H-SR4 800G OSFP 2xSR4系列, Optical Transceivers, 光纤配件0-70C, 1, 1.12, 100G, 100G-PAM4, 100m, 14, 200G, 200GbE, 2x400G, 2xMPO, 2xSR4, 3.3V, 4, 4.0, 400G, 400GbE, 5, 50G, 53.125GBd, 6/6, 70m, 8, 8-lane, 800, 800G, 800GBASE-SR4, 800GbE, 802.3ck, 850nm, 8x100G, 8x53.125GBd, AI, AI/ML, Air-cooled, AOC, APC, Array, BER, Broadcom, Cable, Case, center, channels, Class, Cloud, Cluster, CMIS, Commercial, compliant, Computing, Connector, ConnectX-7, Converged, DAC, Data, DCI, Direct, Disaggregated, Dual, Ethernet, Eye, F-tone, fabric, Factor, FEC, Fiber, Finned, Finned-top, Form, FTCO-8H-SR4, Gen5, Gen6, Generative, Gigabit, GPU, HDR, High, Hot, HPC, Hyperscale, IEEE, Inference, InfiniBand, Interconnect, lambda, Laser, Leaf, LLM, Max, Mellanox, ML, MMF, Modulation, Module, MPO, MPO-12, MPO12, MSA, Multimode, NDR, Network, Networks, NVIDIA, NVMe-oF, Octal, OM3, OM4, Optical, OSFP, OSFP-RHS, over, pam4, PCIe, per, Performance, pluggable, Port, Post, Power, Pre, QSFP-DD, Quantum, Range, RDMA, Reach, Receptacle, RoCE, RoHS, Safety, short, Single, Small, Spine, Spine-Leaf, splitter, SR, SR4, SR8, Storage, Supply, Switch, TDECQ, TECQ, Temperature, Tomahawk, Top, Top-of-Rack, ToR, training, Transceiver, Twin-port, v2, V3.06, VCC, VCSEL, vs, Watts, 北亿纤通
FTGA-12TR851X-02I 12路 10.3125Gbps 850nm 多模 LGA 压接式并行光模块 (MT/UPC 散纤 -55~85°C) | F-tone Networks 北亿纤通
100M-6G光模块, 10G光模块, FTGA-12TR851X-02I系列-11dBm, -4dBm, -55, -55℃~85℃, 0xA0, 0xA1, 10.3125Gbps, 10.3Gbps, 1000V, 100m@10.3125Gbps, 100m@OM3, 100Ω, 10G, 10Gb/s, 1100mA, 12-Channel, 12路并行10G, 12路并行光模块, 12通道并行, 1600mV, 200-pin电连接器, 200mV, 200mV~1600mV, 200pin, 200pin连接器, 24mm×20.3mm×4mm, 24芯MT, 24芯MT/UPC, 24芯MT接口, 24芯MT散纤, 2dBm, 3.5W, 4dB, 500V, 840nm, 85°C, 850nm, 850nm多模, 860nm, ALERTN, Array, DI[1:12]N, DI[1:12]P, DO[1:12]N, DO[1:12]P, ER, ESD, FTGA-12TR851X-02I, GNDR, GNDT, Grid, HBM, I2C, InfiniBand, Infiniband互连, Land, LGA, LGA压接, LGA压接光模块, LGA压接式, LGA封装, LGA封装光模块, LGA并行光模块, LGA弹性压接, LGA弹性接触, LVPECL, MT/UPC, OM3, Optical, Parallel, RESETN, RXEN, SCL, SD, SDA, SFP+等效, Supercomputer, to, TXEN, VCCR33, VCCT33, VCSEL, 中心波长, 低温告警, 内部上拉10K, 内部温度监控, 压接式LGA, 宽温光模块, 封装尺寸, 封装尺寸24mm×20.3mm×4mm, 尾纤72mm, 工业级并行光模块, 工作电流1100mA, 差分信号输入电压, 差分输入匹配阻抗, 平均发射光功率, 平行光模块, 并行光模块, 接收灵敏度, 散纤, 最大功耗3.5W, 机柜内互连, 机柜间互连, 欠压告警, 消光比, 温度监控, 电压监控, 短程多通道并行数据通信, 短程并行, 过压告警, 饱和光功率, 高温告警, 高温壳温, 高速互连, 高速并行光模块