FTGA-12TR8525G-02I 压接式 LGA 封装 12 路并行光收发一体模块 V3.06 (12×25.78125Gbps 多模 850nm VCSEL 70m@OM3 100m@OM4 MT/APC 斜8°研磨 38×24×5.5mm -55~+85°C 超宽温 CDR 切换 I2C 0xA0 数字监控 12通道光功率) | F-tone Networks 北亿纤通10G 光模块, FTGA-12TR851X-02I系列, FTGA-12TR8525G-02I系列-3dBm, -55°C to +85°C, -55~+85, -9dBm, +85°C, +85C, 0xA0, 0xA1, 10.3125 Gbps, 100 ohm Differential, 12 x 25.78125 Gbps, 24 Fiber MT, 24 Fiber MT Ferrule, 24 芯 MT 插芯, 25.78 Gbps, 25Gbps, 2800mA Current, 8 Degree Angle, 8.5Gbps, 8° Angle, 850 nm, AC CML, AI Compute, AI GPU, AI Server, AI 算力, AI 算力互联, Alarm Signal, APC Polish, ASIC Connection, CDR Switching, Differential Impedance, Extended Temperature, FTGA-12TR8525G-02I, HPC AI, HPC Cluster, HPC Data Center, HPC GPU, HPC Supercomputer, Industrial Wide Temp, Inter-cabinet, Inter-rack, Intra-cabinet, Intra-rack, LGA 板载光模块, Logic Level, MARGIN, Memory Map, MT Connector, MT 插芯, Parallel Optical Module, Power Supply 3.3V, Rack to Rack, Rack-to-rack, Single Power Supply, Storage Temperature, Supercomputer Interconnect, Supercomputing, Wide Temperature, 光收发一体, 复位, 工业级宽温, 斜8度角, 超宽温, 超算, 超级计算机, 超级计算机机柜间
FTGA-12TR8525G-02I 压接式LGA封装12路并行光收发一体模块技术规格书10G 光模块, FTGA-12TR8525G-02I系列12 x 25.78125 Gbps, 12路并行光模块, 24芯MT, 25.78125Gbps, 850nm多模, CML电平, FTGA-12TR8525G-02I, I2C接口, LGA封装, 工业级光模块, 并行光通信, 超级计算机机柜间
FTOA-8H-OA-Pxx-xx 800G OSFP112 Passive DAC 高速铜缆 (0.5/1/1.5/2/3米 30/28/26 AWG 112Gb/s PAM4 IEEE 802.3ck) | F-tone Networks 北亿纤通10G 光模块, FTOA-8H-OA-Pxx-xx 800G, 光模块, 布线与配线管理0-70°C, 0.5m, 1.5M, 100, 100G, 100Ω, 125N, 16, 180°, 1m, 2-wire, 20, 26AWG, 28AWG, 2M, 2x8, 3.3V, 300V, 30AWG, 3m, 50, 8, 800G, 802.3ck, 8x, 90N, AI, AI/ML, and, Assembly, Attach, Bandwidth, Base, Bend, Cable, Cage, Card, center, Channel, Class, Cloud, Cluster, Communication, Compatible, Compliance, Computing, Contact, Copper, crosstalk, Cycles, DAC, Data, DCI, Dielectric, Differential, Direct, Durability, End, Ethernet, F-tone, Factor, Finned, Flex, Form, Gas, GPU, High, High-Speed, Hot, HPC, Hyperscale, I2C, IEEE, in, Insertion, Insulation, INT/RSTn, Interconnect, Interface, lane, Leaf, Length, Level, Link, Loss, low, Maximum, Mechanical, Module, MSA, Networks, of, ohm, Operating, OSFP, OSFP112, Pairs, pam4, Passive, per, Performance, Plug, pluggable, Power, QSFP, QSFP112, Rack, Resistance, Retention, Return, Rev, RoHS, Router, SCL, SDA, SDD21, Serial, Server, SFF-8636, Shock, Signal, Signals, Single, Speed, Spine, Spine-Leaf, Storage, Switch, Temp, Temperature, Thermal, to, Top, ToR, Transition, Twin-port, Upgrade, V3.06, VCC, Vibration, Voltage, Withstanding, 北亿纤通
FTCO-8H-CO-Pxx 800G Twin-port OSFP to OSFP Passive Copper Cable DAC 高速铜缆 (0.5/1/1.5/2/3米 30/28/26 AWG Finned Top 0.1W) | F-tone Networks 北亿纤通10G 光模块, FTCO-8H-CO-Pxx 800G OSFP, 光模块, 布线与配线管理-40, (Halogen, (Lead, +85°C, 0, 0-70°C, 0.1, 0.5, 0.5A, 0.5m, 1.5M, 100G, 100G-PAM4, 10x, 125N, 16, 180°, 1m, 2, 26AWG, 28AWG, 2M, 2x, 2x400G, 2x400Gb/s, 2x8, 3, 3.3V, 30AWG, 30V, 3m, 50, 70°C, 8, 8-Channel, 800G, 800Gb/s, 90N, AI, AI/ML, Assembly, Attach, Bend, C, Cable, Capacitance, Case, center, Channel, Cloud, Cluster, compliant, Contact, Control, Copper, Cycles, DAC, Data, DC, Deep, Definition, Differential, Dimensions, Direct, Durability, End, Energy, Ethernet, F-tone, fabric, Factor, Finned, Finned-top, Flex, Force, Form, Free, Halogen, HF, High, High-Speed, Hot, Hot-Pluggable, HPC, Humidity, Hyperscale, Inference, InfiniBand, Input, Interconnect, Jacket, lane, Latch, Latency, Layout, Lead, Leaf, Length, Link, Loss, low, Mating, Max, Modulation, Module, MSA, NDR, Networks, NVIDIA, Octal, OD, of, ohms, Operating, OSFP, P2P, Pad, Pairs, pam4, Passive, PCB, per, Pin, pluggable, Point-to-Point, Power, Pre-terminated, Relative, Retention, Return, Rev, RoHS, SDD21, SFF-8636, SFF-8665, Signals, Single, Small, Speed, Spine, Spine-Leaf, Storage, Supply, Switch, Switch-to-Switch, Temperature, to, Tolerance, Top, training, Twin-port, Type, V3.06, Video, Voltage, Zero, 北亿纤通
FTCO-8H-SR4 800G Twin-port OSFP 2xSR4 多模 100m 光模块 (8 通道 100G-PAM4 850nm VCSEL 2xMPO-12 APC 14W CMIS 4.0) | F-tone Networks 北亿纤通10G 光模块, FTCO-8H-SR4 800G OSFP, 光模块, 布线与配线管理1, 100G, 100G-PAM4, 100m, 200G, 2x400G, 3.3V, 4, 400G, 5, 50G, 8, 800G, 802.3ck, 850nm, AI, AI/ML, AOC, APC, Array, BER, Cable, Case, center, channels, Class, Cloud, Cluster, CMIS, Commercial, compliant, Computing, Connector, DAC, Data, DCI, Direct, Disaggregated, Dual, Ethernet, Eye, F-tone, fabric, Factor, Fiber, Finned, Finned-top, Form, Gigabit, GPU, High, Hot, HPC, Hyperscale, IEEE, Inference, InfiniBand, Interconnect, Laser, Leaf, Max, Mellanox, MMF, Modulation, Module, MPO, MSA, Multimode, NDR, Network, Networks, NVIDIA, Octal, OM3, OM4, Optical, OSFP, over, pam4, PCIe, per, Performance, pluggable, Port, Post, Power, QSFP-DD, Quantum, Range, Reach, Receptacle, RoHS, Safety, short, Single, Small, Spine, Spine-Leaf, splitter, SR, SR4, Storage, Supply, Switch, Temperature, Top, ToR, training, Transceiver, Twin-port, V3.06, VCC, VCSEL, 北亿纤通
FTGA-12TR851X-02I 12路 10.3125Gbps 850nm 多模 LGA 压接式并行光模块 (MT/UPC 散纤 -55~85°C) | F-tone Networks 北亿纤通100M-6G光模块, 10G 光模块, FTGA-12TR851X-02I系列-11dBm, -55, -55℃~85℃, 0xA0, 0xA1, 10.3125Gbps, 10.3Gbps, 1000V, 100Ω, 10G, 10Gb/s, 12-Channel, 12路并行光模块, 200-pin电连接器, 200mV~1600mV, 200pin, 200pin连接器, 24芯MT, 2dBm, 4dB, 500V, 840nm, 85°C, 850nm, 850nm多模, 860nm, Array, ER, ESD, GNDR, GNDT, Grid, HBM, I2C, InfiniBand, Infiniband互连, Land, LGA, LGA压接, LGA压接光模块, LGA压接式, LGA封装, LGA封装光模块, LGA并行光模块, LGA弹性压接, LGA弹性接触, LVPECL, MT/UPC, OM3, Optical, Parallel, SCL, SD, SDA, SFP+等效, Supercomputer, to, VCSEL, 中心波长, 压接式LGA, 宽温光模块, 封装尺寸, 工业级并行光模块, 工作电流1100mA, 平均发射光功率, 平行光模块, 并行光模块, 接收灵敏度, 机柜内互连, 机柜间互连, 消光比, 温度监控, 电压监控, 短程多通道并行数据通信, 短程并行, 饱和光功率, 高温壳温, 高速互连, 高速并行光模块
FTGA-24TR851X-02DI 24路 10.3125Gbps 850nm 多模 LGA 压接式并行光模块 (MT/UPC -55~85°C) | F-tone Networks 北亿纤通100M-6G光模块, 10G 光模块, FTGA-24TR851X-02DI系列-10dBm, -55, -55℃~85℃, -5dBm, 0xA0, 0xA1, 10, 10.3125Gbps, 10.3Gbps, 1000V, 10G, 10Gb/s, 10GbE, 200-pin电连接器, 200pin, 200pin连接器, 2dBm, 3.3V, 4dB, 500V, 840nm, 85°C, 850nm, 850nm多模, 860nm, AC, AC耦合, Array, CML, CML电平, Connector, DDMI, ER, ESD, Ethernet, Gigabit, GND, Grid, HBM, I2C, InfiniBand, Infiniband互连, Land, LGA, LGA压接, LGA压接光模块, LGA压接式, LGA封装, LGA封装光模块, LGA并行光模块, LGA弹性压接, LGA弹性接触, MT/UPC, NIC, NTC, OM3, OM4多模, Optical, Parallel, SCL, SD, SDA, SFP+等效, Supercomputer, Telemetry, to, Tx_dis, VCC, VCSEL, 中心波长, 压接式LGA, 外壳温度监控, 宽温光模块, 封装尺寸, 工业级并行光模块, 平均发射光功率, 平行光模块, 并行光模块, 接收灵敏度, 数字诊断监控, 机柜内互连, 机柜间互连, 消光比, 温度监控, 电压监控, 短程多通道并行数据通信, 短程并行, 饱和光功率, 高温壳温, 高速互连, 高速并行光模块
10G DWDM C47 SFP+ Transceiver – F-tone Compatible 10GBASE-DWDM Optical Module10G 光模块100G, 100GBASE-SR4
10G DWDM SFP+ C-band Transceiver – F-tone Compatible Optical Module10G 光模块, CWDM/DWDM/BiDi 光模块100G, 100GBASE-SR4
